Price: $43.90
(as of Nov 13, 2024 22:58:32 UTC – Details)
CanMV-K230 specifications:
- SoC – Kendryte K230CPU64-bit RISC-V processor @ 1.6GHz with RISC-V Vector Extension 1.0, FPU
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- 64-bit RISC-V processor @ 800MHz with support for RV64GCB instruction set;
- AI acceleratorKPU with support for INT8 and INT16
- Compatible with TVM, TensorFlow, Pytorch, ONNX
- Typical network performance: Resnet 50 ≥ 85fps @ INT8; Mobilenet_v2 ≥ 670fps @ INT8; YoloV5S ≥ 38fps @INT8;
- “DPU” using 3D structured light depth calculation up to 1280×800 @ 30fps
- VPU – Video encoding/decoding for H.264/H.265/JPEG/MJPEG up to 4Kp40/4Kp20
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- System Memory: 512MB LPDDR3
- Storage – QSPI flash, microSD card slot
- Display – HDMI port, MIPI DSI connector up to 1080p60
- Audio – 3.5mm audio jack
- Camera – Up to 5MP camera, up to 3-ch MIPI CSI inputs
- Networking
10/100Mbps Ethernet RJ45 port
WiFi 4 and Bluetooth 4.0 via AP6212 wireless module
- USB – 1x USB 2.0 OTG Type-C port port
- Expansion – 40-pin GPIO header with up to 29x GPIOs, 5x PWM, 4x I2C, 2x UART
- Misc – Buttons, RGB LED
- Power Supply – 5V via USB-C port
- Dimension – 85 x 56 mm
Support:
Forum: forum.youyeetoo.com (recommended)
Communication and personal advice:
am2#youyeetoo.com (#>>@)
CanMV-K230 is a credit card-sized development board for AI and computer vision applications based on the Kendryte K230 dual-core C908 64-bit RISC-V processor with built-in KPU (Knowledge Process Unit) and various interfaces such as MIPI CSI inputs and Ethernet.
Shipping List(Basic Kit): 1* CanMV-K230, 1* Camera, 1* Type-C Cable for Power / Debug, 1* 2.4G/5G Antenna
SoC: Dual-core C908. High-performance AI acceleration unit (KPU), AI performance is 13.7 times that of K210
AI multi-modal: vision/speech/OCR/translation NMT support, and complete AI development tools
Support RVV1.0. Support Three 4K HD camera inputs. Integrated DPU Full HD 3D depth engine, supports 1080P resolution
Built-in dozens of AI algorithms, such as: face recognition, color recognition, etc. Provide schematic, PCB and other hardware design information, provide SDK, provide chip manuals.
